What is the difference between bakelite and fiberglass board?

Bakelite is suitable for low frequency circuits. Glass fiber board, also known as epoxy board, is suitable for high frequency circuits.
PF bakelite is also called bakelite, phenolic laminate. The bleached wood block paper and cotton wool paper are used as reinforcements, and the phenolic resin made from high-purity, fully synthetic petrochemical raw materials is used as the resin binder. pom sheet is suitable for PCB drilling, silicone rubber mold. Fixtures, switchboards, electrical machinery parts, suitable for motors, electrical equipment and insulation structural parts with high mechanical performance requirements. Good mechanical strength, mainly used in the processing of insulating parts in ICT, ITE fixtures, test fixtures, silicone rubber key molds, fixture plates, mold plywood, table polishing pads, packaging machines, tea tray combs, etc. The composition of bakelite is mainly phenolic resin, and the general heat resistance rating of phenolic laminated paperboard in phenolic resin is E grade, and the maximum temperature of abs board is 120 ℃. It can work normally. For a short time above 120 ℃, the bakelite can still work, but if it exceeds 120 ℃ for a long time, the insulation performance of the bakelite will be weakened until the insulation material we often say is aging and the breakdown voltage decline. Bakelite density 1.5
Thickness:
Insulation temperature class A class E class B class F class H class
Maximum allowable temperature (℃) 105 120 130 155 180
Winding temperature rise limit (K) 60 75 80 100 125
Performance reference temperature (℃) 80 95 100 120 145
Specifications: Sheet: thickness x width x length = 3-20 * 1220 * 2440 (1020 * 1200)
Bar: diameter * length = 3-20 * 1000
Origin: Germany’s Dupont, Gael, Taiwan Xinyin, Beijing Furunda
Colors orange, orange, black, brown abs board epoxy board FR4, epoxy glass fiber board, epoxy phenolic laminated glass cloth board epoxy resin refers to those containing two or more epoxy groups in the molecule Except for individual organic polymer compounds, their relative molecular masses are not high. The molecular structure of epoxy resin is characterized by containing active epoxy groups in the molecular chain. The epoxy groups can be located at the end, middle or cyclic structure of the molecular chain. Because the molecular structure contains active epoxy groups, they can cross-link with various types of curing agents to form insoluble, PC board insoluble polymers with a three-way network structure. This product epoxy board: glass fiber cloth is bonded with epoxy resin to make it heated and pressurized. The model is 3240. It has high mechanical properties at medium temperature and stable electrical properties under high humidity. It is suitable for mechanical, electrical and electronic parts with high insulation structure. It has high mechanical and dielectric properties, good heat resistance and moisture resistance. Heat resistance class F (155 degrees). Density 1.9
Specifications: Sheet: thickness * width * length = 0.1-100 * 1000 * 2000 (1020 * 1220)
Bar: diameter * length = 6-200
Color: water green, white, yellow hand material Origin: domestic